WS150N Water Soluble Flux
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Item #: WS150N
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150N Aqua Flux

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INTRODUCTION
150N Aqua Flux is a pH neutral liquid flux formulated for producing defect free assemblies in wave soldering processes employing water cleaning. It provides excellent ionic cleanliness after water cleaning. 150N contains no free acid but possesses a high activity level. 150N Aqua Flux is also suitable for surface mount assembly soldering operations.
APPLICATION TEST RESULTS
150N Aqua Flux is a low smoking, neutral pH foam flux. Using moderate airflow rates, its fine-bubble foam head is fast breaking and recovers rapidly for effective coverage at high production speeds. This active flux will produce bright shiny solder connections. The residues wash off easily to very low levels of ionic contamination. Water washing can be done without the use of rinse aids. Cleaning can be delayed because the flux has no free acids. The flux is formulated so that the cleaning process water effluent is completely biodegradable. Local regulations may require pretreatment to raise the pH to remove dissolved lead from water effluent.
J-STD-004 (IPC Tm-650) Test Result
Flux Type (per J-STD-004) ORM1
Copper Mirror Moderate
Halide Test Not Available
Silver Chromate Fail
Fluoride Test Zero
SIR Pass after clean
Electromigration Pass after clean
Physical Properties Values
Solids Content 23.0%-24.0%
Specific Gravity @ 20oC 0.84-0.88
Acid Number (mg KOH/gm) 7.5-9.0
Color Clear to Light Amber
ATTRIBUTES
  • Excellent cosmetics and easy rinsing
  • Superior activity offering good solderability on all surface finishes
  • Good topside wetting
FLUX CONTROL  SPRAY SYSTEMS
The specific gravity of the flux should be maintained between 0.85 and 0.87.

The amount of flux to be applied during foaming applications should be between 800 and 1300 micrograms per square inch of solids. The amount of flux to be applied during spray application should be between 475 and 850 micrograms per square inch of solids.
Ideally an air knife should be fitted even when using a spray system in order to prevent insufficient capillary action when soldering. Spray system air knives should normally be angled slightly towards the system.
FOAMING SYSTEMS  CONVEYOR SPEED
The air knife hole diameter should be between 1 and 1.5 mm and the distance from the fluxer to the air knife should be approximately 4 to 6 inches. The air knife should be angled between 5 to 12 degrees away from the foam wave so that excess flux can be removed without destroying the foam head. The ideal conveyor speed is dependent on the type of board and preheat requirements, but a speed between 3.5-6.5 feet will suit most applications.
ANALYSIS (Buret)  THINNING
Step Result
Titration Pipet 5 ml of WS150N into titration flask
Add 40-50 ml of D.I. water or IPA
Add 2-3 drops of Phenolphthalein indicator solution and mix well
Titrate the mixture with 0.1 N base from clear to a pink endpoint
Record the volume of NaOH used
Calculations Calculation for acid content of WS150N:

Acid number (mg NaOH/g flux) = (mils of 0.1N base) X 1.38
The consistency of 150N Aqua Flux should be maintained by the addition of thinner to compensate for evaporation losses. It is recommended that the specific gravity @77°F be maintained between 0.850 and 0.865 by addition of thinner. Only Flux Thinner FT-100 should be used for this purpose to ensure consistency of flux foaming and soldering characteristics.
PREHEAT  SOLDER TEMPERATURE
A topside temperature between 80-110°C is recommended. A bottom side temperature should be 35°C higher than the topside. A solder temperature between 230-250°C should be maintained.
AVAILABILITY  SAFETY AND HANDLING
WS150N Water Soluble Liquid Flux is readily available in 5 gallon pails and 55 gallon drums. Keep away from heat, sparks and open flames. Use in well-ventilated area and observe standard precautions for handling and use. Refer to the Material Safety Data Sheet for further information.

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