Framed SMT Stencils - UltraSlic™
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| INTRODUCTION |
| Framed SMT Stencils or glue-in stencils are laser cut solder paste stencil foils permanently mounted in a stencil frame using a mesh border to tightly stretch the stencil foil tight in the frame. The Stencil frame holds the stencil and mounts into the print system. Framed SMT Stencils are designed for high volume screen printing on printed circuit boards. All of our laser cut stencils provide optimum solder paste volume control and outstanding release. Framed SMT Stencils have smooth aperture walls and can be used for 16 Mil pitch and below and for Micro BGA"s. |
| MATERIAL |
UltraSlic™ high performance stencil technology has become the preferred choice when printing assemblies with challenging miniature components. The addition of a permanent, hydrophobic nano-coating to the UltraSlic™ stencil foil minimizes solder paste’s ability to stick to the stencil apertures and the bottom side of the foil. Up to a 10X increase in the number of prints before cleaning the stencil is possible as well as successful printing at surface area ratios below 0.45. The addition of nano-coating to the UltraSlic™ stencil further increases the performance gap between it and any other stencil technology available today.
The UltraSlic™ FG Stencil has a grain size of just 1 to 2 microns while standard laser-cut stainless steel material has a grain size of 20 to 30 microns. UltraSlic™ FG stencils will play an important role in enabling OEMs and contract manufacturers to tackle the next generation of assemblies containing µBGA, CSP, QFN, and 01005 components.
The Fine Grain stencil material used in UltraSlic™ FG stencils has a durability comparable to standard full hard 300 series stainless steel and print performance comparable to electroformed stencils. However, UltraSlic™ FG stencils have superior fatigue strength, an elevated wear factor, more accurate aperture registration, and a more uniform foil thickness. When printing small/miniature components with very low surface area ratios, accurate aperture registration and an extremely uniform foil thickness is critical to achieving acceptable paste release. Surface area ratios drop as the foil thickness increases and poor aperture registration prevents all of the solder paste from touching the SMT land pads. Both negatively affect paste release. The ability to print apertures with surface area ratios as low as 0.45 also greatly reduces the need to use thinner foils, or stepped stencils, to achieve the desired print performance. This helps to ensure enough solder volume for the larger components while getting the desired print performance for the small/miniature components.
All UltraSlic™ FG stencils are 100 percent AOI inspected for aperture presence and registration minimizing the opportunities for stencil rework or replacement. UltraSlic™ FG stencils should be used, cleaned, and stored just like any other solder paste stencil. With durability comparable to standard laser-cut and electroformed stencils, expected stencil life is the same. Repairs of damaged UltraSlic™ FG stencils, as with any stencil, are highly dependent on the extent of the damage. A higher, more consistent solder volume contributes to higher yields and lower rework which produces more reliable solder joints and lower failures in the field.
UltraSlic™ FG stencils have lower standard deviations, higher repeatability, and cleaner release of solder paste compared to other stencil technologies. A more consistent solder paste deposition, a reduction in stencil cleaning frequency, and minimized rework result in higher yields and tremendous throughput improvements.
UltraSlic™ FG stencils are used exactly the same as one would use standard laser-cut or electroformed stencils. No special printer settings or stencil cleaning solution is required. Durability is comparable to that of standard laser-cut and electroformed stencils. Customers will not notice a difference in handling, cleaning, and storage, but they will notice a difference in performance. |
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STOCK THICKNESSES |
SPECIFICATIONS |
| Foil Thickness |
Material |
| 0.003" |
UltraSlic™ |
| 0.004" |
UltraSlic™ |
| 0.005" |
UltraSlic™ |
| 0.006" |
UltraSlic™ |
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| Technology |
100% Laser Cut |
| Material |
UltraSlic™ |
| Stencil Thickness |
0.001" - 0.016" |
| Minimum Cut Width |
0.002" |
| Maximum Size |
29" x 29" |
| Aperture Tolerance |
Within 0.00025 |
| Allow for Fiducial Data |
Yes |
| Allow for Panelized Data |
Yes |
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AVAILABILITY |
We fabricate Framed SMT stencils for all variety of stencil printers. Fine
Line Stencil combines exceptionally quick turnarounds to deliver optimized print deposit consistency.
For More information about this product please visit: www.finelinestencil.com |
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