NC120 No Clean Liquid Flux
Download the TDS and MSDS for this product.
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| INTRODUCTION |
| NC120 Low Residue NO CLEAN FLUX is halide-free, non-rosin, organic 2% solids activated material for wave soldering through-hole, mixed and surface mount assemblies. NC120 is formulated to eliminate bridges or icicles, and provide excellent solderability with minimal flux residue so that cleaning is not necessary. |
| APPLICATION |
TEST RESULTS |
NC120 Low Residue NO CLEAN FLUX is formulated for
foam, spray, wave or dip applications. NC120 is suitable
for conventional, mixed, and surface mount technologies
for telecommunications, computer and general consumer
electronics.
Before use, read all material safety data information.
Previously used flux should be thoroughly cleaned out of
the system since small amounts can reduce the
performance of the NC120. Conveyors, pallets and
fingers should be cleaned. During extended periods of
time such as nights and weekends the flux should be
removed from the machine and stored in a sealed
container. The air stone should be left soaking in Florida CirTech thinners (FT100) and changed before the quality
of the foam deteriorates. It is recommended that you use
a new stone when replacing Rosin type fluxes. A program
should be established for the regular replacement of the
flux to avoid the buildup of contaminants within the flux.
For optimal soldering consistency, the flux should be
disposed of once every 40 hours of operation. |
| J-STD-004 (IPC Tm-650) Test |
Result |
| Flux Type (per J-STD-004) |
ORL0 |
| Copper Mirror |
Low |
| Halide Test |
<0.05% |
| Silver Chromate |
Pass |
| Fluoride Test |
Pass |
| SIR |
Pass |
| Electromigration |
Pass |
| Physical Properties |
Values |
| Solids Content |
1.9%-2.1% |
| Specific Gravity @ 20oC |
0.81-0.84 |
| Acid Number (mg KOH/gm) |
14-17 |
| Color |
Clear and Colorless |
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| ATTRIBUTES |
- Excellent cosmetics and very low residue
- Superior activity offering good solderability on
all surface finishes
- Good topside wetting
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|
FLUX CONTROL |
SPRAY SYSTEMS |
| The specific gravity of the flux should be maintained
between 0.81 and 0.84. The amount of flux to be applied
during foaming applications should be between 800 and
1300 micrograms per square inch of solids. The amount
of flux to be applied during spray application should be
between 475 and 850 micrograms per square inch of
solids. |
Ideally an air knife should be fitted even when using a
spray system in order to prevent insufficient capillary
action when soldering. Spray system air knives should
normally be angled slightly towards the system.
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|
FOAMING SYSTEMS |
CONVEYOR SPEED |
| The air knife hole diameter should be between 1 and 1.5
mm and the distance from the fluxer to the air knife
should be approximately 4 to 6 inches. The air knife
should be angled between 5 to 12 degrees away from the
foam wave so that excess flux can be removed without
destroying the foam head. |
The ideal conveyor speed is dependent on the type of
board and preheat requirements, but a speed between
3.5-6.5 feet will suit most applications.
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|
ANALYSIS (Buret) |
THINNING |
| Step |
Result |
| Titration |
Pipet 5 ml of NC120 into titration flask |
| Add 40-50 ml of D.I. water or IPA |
| Add 2-3 drops of Phenolphthalein indicator
solution and mix well |
| Titrate the mixture with 0.1 N base from
clear to a pink endpoint |
| Record the volume of NaOH used |
| Calculations |
Calculation for acid content of NC120:
Acid number (mg NaOH/g flux) = (mils of 0.1N base) X 1.38 |
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The flux solids will need to be controlled by the addition
of FT100 flux thinner to compensate for evaporative
losses of the flux solvents during operations. In order to
control the flux solids it is advisable to monitor the acid
number rather than the specific gravity since the solids
content is below 5 percent. The acid number should be
maintained between 15.0 and 17.0. If the foam fluxer is
in continuous operation then the acid number should be
checked every two to four hours. An addition of 5.3% FT-
100 by volume will lower the acid number by 1.
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PREHEAT |
SOLDER TEMPERATURE |
| A topside temperature between 80-110°C is
recommended. A bottom side temperature should be
35°C higher than the topside. |
A solder temperature between 230-250°C should be
maintained.
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|
AVAILABILITY |
SAFETY AND HANDLING |
| NC120 No Clean Liquid Flux is
readily available in 5 gallon pails and 55 gallon drums. |
Keep away from heat, sparks and open flames. Use in
well-ventilated area and observe standard precautions for
handling and use. Refer to the Material Safety Data
Sheet for further information.
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