BGA Rework Stencil - Cirlex with PSA
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Item #: BGARSPSA
Our Price: $110.00 - $530.00
 
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BGA Rework Stencils - Cirlex with PSA

INTRODUCTION
BGA Rework Stencils are now available direct to you and may be a major product improvement over what you are may be using now. FCT Assembly BGA Rework Stencils are designed to make your rework faster and cleaner. The materials used, design and precision cutting allows you to simplify the placement/replacement of area array devices such as BGAs and CSPs and other leaded SMT devices.
MATERIAL
FCT Assembly BGA Rework flexible solder paste stencils are laser cut from high quality, anti-static polymer film (Cirlex) and come with a residue-free pressure sensitive adhesive (PSA) backing. The addition of PSA to our line of stencils ensures they are self-sticking and that no tape or fixturing is required. The adhesive seals around each BGA pad to prevent solder paste from bleeding under the stencil when the paste is applied and eliminates residue left on the board surface.

Typical BGA rework stencils made from metal require taping to position them and hold them in place. Metal stencils have a tendency to bend or warp and if the circuit board has undulations in the board surface, the metal stencil will not sit flat. Since there is no adhesive seal, solder paste can bleed under metal stencils when paste is applied with a squeegee.
ATTRIBUTES  SPECIFICATIONS 
  • Residue-free adhesive backing seals around BGA pads to prevent solder paste bleed.
  • Precise laser cut ensures correct aperture size.
  • Disposable stencils that eliminate tedious stencil cleaning.
  • Flexible stencils conform to board surface.
  • Low cost.
Technology 100% Laser Cut
Material Cirlex
Stencil Thickness 0.004" & 0.008"
Aperture Tolerance Within 0.00025
AVAILABILITY 
FCT Assembly BGA Rework Stencils are sold based upon Ball Count and adhesive backing needed. To order FCT Assembly custom BGA rework stencils please select the Ball Count range and adhesive requirements for your needs. Once you have selected the appropriate Ball Count and adhesive requirements, you will submit a CADD, Gerber or datasheet file for the BGA Stencil selected. This is all we need to create your custom precision laser cut BGA Rework Stencils. BGA Rework Stencils are sold in packs of ten (10).

Our standard turn-around time is (5) business days, however, should you need them faster, we can provide 24-48hr expedited turn-around time.

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