BGA Rework Stencils - Cirlex
|
| INTRODUCTION |
| BGA Rework Stencils are now available
direct to you and may be a major product improvement over what you are
may be using now. FCT Assembly BGA Rework Stencils are designed to make your rework faster and cleaner. The materials used, design and precision cutting allows you to simplify the placement/replacement of area array devices such as BGAs and CSPs and other leaded SMT devices. |
| MATERIAL |
| FCT Assembly BGA Rework flexible solder paste stencils are laser cut from high quality, anti-static polymer film (Cirlex).
|
|
ATTRIBUTES |
SPECIFICATIONS |
- Precise laser cut ensures correct aperture size.
- Disposable stencils that eliminate tedious stencil cleaning.
- Flexible stencils conform to board surface.
- Low cost.
|
| Technology |
100% Laser Cut |
| Material |
Cirlex |
| Stencil Thickness |
0.003" & 0.007" |
| Aperture Tolerance |
Within 0.00025 |
|
|
AVAILABILITY |
FCT Assembly BGA Rework Stencils are sold based upon Ball Count and adhesive backing needed. To order
FCT Assembly custom BGA rework stencils please select the Ball Count range and adhesive requirements for your needs. Once you have selected the appropriate Ball Count and adhesive requirements, you will
submit a CADD, Gerber or datasheet file for the BGA Stencil selected. This is all we need to create your custom precision laser cut BGA Rework Stencils.
BGA Rework Stencils are sold in packs of ten (10).
Our standard turn-around time is (5) business days, however, should you need them faster, we can provide 24-48hr expedited turn-around time. |
|